ISTFA 2021
Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
Specificaties
| ISBN/EAN | 9781627084192 |
| Auteur | ASM International |
| Uitgever | Van Ditmar Boekenimport B.V. |
| Taal | Engels |
| Uitvoering | Paperback / gebrocheerd |
| Pagina's | 461 |
| Lengte | |
| Breedte |